Rich retired from IBM June 2006 after 37 years in the microelectronics business area. He was a recognized leader filling key technical and management roles including process development, yield achievement, manufacturing plant integration, and operational support across a wide spectrum of leading edge technologies world wide. Technologies included semiconductor processing, laminate and ceramic chip carriers, card and board manufacturing and assembly. His assignments took him regularly to IBM and customer facilities in Europe, Asia, and various United States and Canadian venues.

From 1998 to the present Rich’s primary assignment was resolving IBM World Wide Packaging and Test business and technical issues. His most recent assignment was a leadership role for an IBM joint venture with SUSS MicroTec of Germany to implement a new semiconductor connection methodology. Other activities included 90 and 65 nm semiconductor yield improvement unit process leadership, disc drive reliability improvement, solving varied world wide supplier board assembly problems, and cost reduction studies.

Also during this time Rich had a leadership role on a team that carried out site selection, equipment selection, facility design, employee training, and organizational structure for an electronics component factory planned to be installed in Shanghai, China that brought together IBM processes from the Yasu, Japan and Endicott, NY sites for leading edge low cost chip carrier manufacturing. This assignment honed Rich’s world wide factory integration and planning skills.

During his career Rich held a number of higher level management positions including Engineering Manager IBM Endicott, which included both board and chip carrier engineering and development, a 220 man effort. He was also World Wide Semiconductor Memory Assembly and Test Sourcing Manager, and Engineering Functional Manager Semiconductor Combined Lines in East Fishkill, a 200 man development and pre-production organization. Prior to this Rich was Multilayer Ceramic Thin Films Engineering Manager and Multilayer Ceramic Engineering Functional Manager, both 100 man manufacturing engineering organization.

Rich received a PhD. as well as a B.A. and B.S. in Ceramic Technology from Rutgers University where he specialized in glass technology with a minor in material analysis.

Rich and his wife Sue reside in Poughkeepsie, New York and are proud of their 4 children and greatly enjoy spending time with them, their 3 spouses, and 4 grandchildren.